Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid

ABSTRACT

In the production method for abrasive grains according to the invention, an aqueous solution of a salt of a tetravalent metal element is mixed with an alkali solution, under conditions such that a prescribed parameter is 5.00 or greater, to obtain abrasive grains including a hydroxide of the tetravalent metal element.

TECHNICAL FIELD

The invention relates to a production method for abrasive grains, aproduction method for a slurry, and a production method for a polishingliquid. The invention further relates to a production method forabrasive grains to be used in substrate surface flattening steps,especially flattening steps for Shallow Trench Isolation insulatingfilms, premetal dielectric layers and interlayer dielectric films, insemiconductor element manufacturing technology, to a production methodfor a slurry comprising the abrasive grains, and to a production methodfor a polishing liquid comprising the abrasive grains.

BACKGROUND ART

In recent years, machining techniques for increasing density andmicronization are becoming ever more important in manufacturing stepsfor semiconductor elements. One such machining technique, CMP (chemicalmechanical polishing), has become an essential technique inmanufacturing steps for semiconductor elements, for formation of ShallowTrench Isolation (hereunder also referred to as “STI”), flattening ofpremetal dielectric layers and interlayer dielectric films, andformation of plugs and embedded metal wirings.

Fumed silica-based polishing liquids are commonly used in CMP duringconventional manufacturing steps for semiconductor elements, in order toflatten the insulating films such as silicon oxide films that are formedby methods such as CVD (Chemical Vapor Deposition) or spin coatingmethods. Fumed silica-based polishing liquids are produced by conductinggrain growth of abrasive grains by methods such as thermal decompositionwith silicon tetrachloride, and adjusting the pH. However, suchsilica-based polishing liquids have the technical problem of lowpolishing rate.

Incidentally, STI is used for device isolation on integrated circuits ingeneration devices starting from design rules of 0.25 μm. In STIformation, CMP is used to remove excess silicon oxide films afterformation on substrates. In order to halt polishing in CMP, a stopperfilm with a slow polishing rate is formed under the silicon oxide film.A silicon nitride film or polysilicon film is used for the stopper film,preferably with a high polishing selective ratio of the silicon oxidefilm with respect to the stopper film (polishing rate ratio: polishingrate on silicon oxide film/polishing rate on stopper film). Asilica-based polishing liquid such as a conventional colloidalsilica-based polishing liquid has a low polishing selective ratio ofabout 3 for the silicon oxide film with respect to the stopper film, andit tends not to have properties that can withstand practical use forSTI.

On the other hand, cerium oxide-based polishing liquids comprisingcerium oxide particles as abrasive grains are used as polishing liquidsfor glass surfaces such as photomasks or lenses. Cerium oxide-basedpolishing liquids have the advantage of faster polishing rate comparedto silica-based polishing liquids comprising silica particles as theabrasive grains, or alumina-based polishing liquids comprising aluminaparticles as the abrasive grains. In recent years, polishing liquids forsemiconductors, employing high-purity cerium oxide particles, have cometo be used as cerium oxide-based polishing liquids (see Patent document1, for example).

A variety of properties are required for polishing liquids such ascerium oxide-based polishing liquids. For example, it is required toincrease the dispersibility of the abrasive grains such as cerium oxideparticles, and to accomplish flat polishing of substrates withirregularities. Using STI as an example, there is a demand for improvingpolishing selective ratios for inorganic insulating films (such assilicon oxide films) as films to be polished, with respect to thepolishing rates for stopper films (such as silicon nitride films orpolysilicon films). Additives are often added to polishing liquids tomeet this demand. For example, there is known addition of additives topolishing liquids containing cerium oxide-based particles, to controlthe polishing rates of the polishing liquids and improve the globalflatness (see Patent document 2, for example).

Incidentally, as demand increases for achieving greater micronization ofwirings in recent manufacturing steps for semiconductor elements,scratches formed during polishing are becoming problematic.Specifically, when polishing using conventional cerium oxide-basedpolishing liquids, fine scratches have not posed problems so long as thesizes of the scratches are smaller than conventional wiring widths, butthey can be problematic when it is attempted to achieve greatermicronization of wirings.

A solution to this problem is being sought through studying polishingliquids that employ particles of tetravalent metal element hydroxides(see Patent document 3, for example). Methods for producing particles oftetravalent metal element hydroxides are also being studied (see Patentdocument 4, for example). Such techniques are aimed at reducingparticle-induced scratches, by maintaining the chemical action of thetetravalent metal element hydroxide particles while minimizing theirmechanical action.

CITATION LIST

Patent Literature

-   [Patent document 1] Japanese Unexamined Patent Application    Publication HEI No. 10-106994-   [Patent document 2] Japanese Unexamined Patent Application    Publication HEI No. 08-022970-   [Patent Document 3] International Patent Publication No. WO02/067309-   [Patent document 4] Japanese Unexamined Patent Application    Publication No. 2006-249129

SUMMARY OF INVENTION Technical Problem

The techniques described in Patent documents 3 and 4, however, cannot besaid to provide sufficiently high polishing rate, despite reduction inscratches. Since polishing rate directly affects the efficiency of theproduction process, polishing liquids with higher polishing rates aredesired.

When an additive is added to the polishing liquid, the effect obtainedby adding the additive is often offset by reduced polishing rate, and ithas been difficult to achieve polishing rate together with additionalpolishing properties.

The present invention is directed toward solving this problem, and it isan object thereof to provide a production method for abrasive grainsthat allow polishing of films at superior polishing rate compared toconventional abrasive grains, regardless of the presence or absence ofadditives that may be used together with the abrasive grains asconstituent components of the polishing liquid. It is another object ofthe invention to provide a production method for a slurry comprisingabrasive grains obtained by the aforementioned production method, and aproduction method for a polishing liquid comprising the abrasive grainsand an additive.

Solution to Problem

As a result of diligent research on abrasive grains includingtetravalent metal element hydroxides, the present inventors have foundthat polishing of a film can be accomplished at high rate compared toconventional abrasive grains, when using abrasive grains obtained bymixing an aqueous solution of a tetravalent metal element salt with analkali solution in such a manner that specific conditions are satisfied.The present inventors have also found that when a slurry comprising suchabrasive grains is used, it is possible to accomplish polishing of filmsat superior polishing rate compared to conventional polishing liquids,and have further found that when using a polishing liquid having acomposition with additives added to such a slurry, it is possible toaccomplish polishing of films at superior polishing rate compared toconventional polishing liquids, while maintaining the effects of theadded additives.

Specifically, in the production method for abrasive grains according tothe invention, a first liquid which is an aqueous solution of a salt ofa tetravalent metal element is mixed with a second liquid which is analkali solution, under conditions such that parameter Z in the followingformula (1a) is 5.00 or greater, to yield abrasive grains including ahydroxide of a tetravalent metal element.

Z=[1/ΔpH×k)]×(N/M)/1000  (1a)

[In formula (1a), ΔpH represents variation in pH per minute in thereaction system, k represents the reaction temperature coefficientrepresented by the following formula (2), N represents the cycle count(min'), and M represents the substitution count (min⁻¹) represented bythe following formula (5).]

k=2^([(T-20)/10])  (2)

[In formula (2), T represents the temperature (° C.) of the reactionsystem.]

M=v/Q  (5)

-   [In formula (5), v represents the mixing rate (m³/min) of the first    liquid and second liquid, and Q represents the liquid volume (m³) of    the liquid mixture.]

By using a slurry comprising abrasive grains obtained by this productionmethod, it is possible to accomplish polishing of films at superiorpolishing rate compared to conventional abrasive grains. In addition,when using a polishing liquid having a composition with additives addedto the aforementioned slurry, it is possible to accomplish polishing offilms at superior polishing rate while maintaining the effects of addingthe additives. According to the invention, it is also possible toinhibit formation of scratches.

The present inventors have further found that increasing the value ofparameter Z improves the transparency of a solution having the obtainedabrasive grains dispersed in water (hereunder referred to as “aqueousdispersion”), and that greater transparency allows polishing of films tobe accomplished at superior polishing rate compared to conventionalabrasive grains. Specifically, the present inventors found that with aparameter Z value of 5.00 or greater, the obtained abrasive grainsinclude a tetravalent metal element hydroxide and produce lighttransmittance of 50%/cm or greater for light with a wavelength of 500 nmin an aqueous dispersion with a content of the abrasive grains adjustedto 1.0 mass %, and further found that using a slurry or polishing liquidcomprising such abrasive grains allows polishing of films at superiorpolishing rate.

In addition, the present inventors found that further increasing theparameter Z value results in yellow coloration of the aqueousdispersion, with a deeper color being exhibited as the parameter Z valueincreases, and also found that it is possible to accomplish polishing offilms at even more superior polishing rate as the color is deeper.

Specifically, the present inventors found that with a largo parameter Zvalue, the obtained abrasive grains produce absorbance of 1.50 orgreater for light with a wavelength of 400 nm in an aqueous dispersionwith a content of the abrasive grains adjusted to 1.0 mass % whilemaintaining the aforementioned light transmittance of 50%/cm or greater,and further found that using a slurry or polishing liquid comprisingsuch abrasive grains allows polishing of films at an even more superiorpolishing rate.

In addition, the present inventors found that with a large parameter Zvalue, the obtained abrasive grains produce absorbance of at least 1.000for light with a wavelength of 290 mm in an aqueous dispersion with acontent of the abrasive grains adjusted to 0.0065 mass % (65 ppm) whilemaintaining the aforementioned light transmittance of 50%/cm or greater,and further found that using a slurry or polishing liquid comprisingsuch abrasive grains allows polishing of films at an even more superiorpolishing rate. Here, “ppm” represents ppm by weight, or “parts permillion weight”.

In the production method for abrasive grains of the invention, the ΔpHis preferably not greater than 5.00. This will yield abrasive grainsthat allow polishing of films at an even more superior polishing rate.

The cycle count N is preferably 1.00 min⁻¹ or greater. This will yieldabrasive grains that allow polishing of films at an even more superiorpolishing rate.

The substitution count M is preferably not greater than 1.0 min⁻¹. Thiswill yield abrasive grains that allow polishing of films at an even moresuperior polishing rate.

The cycle count N may be represented by the following formula (3),

N=(u×S)/Q  (3)

[In formula (3), u represents the linear speed (m/min) represented bythe following formula (4), for a stirring blade stirring the liquidmixture obtained by mixing the first liquid and the second liquid, Srepresents the area (m²) of the stirring blade, and Q represents theliquid volume (m³) of the liquid mixture.]

u=2π×R×r  (4)

[In formula (4), R represents the rotational speed (min⁻¹) of thestirring blade, and r represents the radius of rotation (m) of thestirring blade.]

The linear speed u is preferably 5.00 m/min or greater. This will yieldabrasive grains that allow polishing of films at an even more superiorpolishing rate.

The mixing rate v is preferably not greater than 1.00×10⁻² m³/min. Thiswill yield abrasive grains that allow polishing of films at an even moresuperior polishing rate.

The rotational speed R of the stirring blade is preferably 30 min⁻¹ orgreater. This will yield abrasive grains that allow polishing of filmsat an even more superior polishing rate.

The temperature T of the reaction system is preferably not higher than60° C. This will yield abrasive grains that allow polishing of films atan even more superior polishing rate.

The concentration of the salt of the tetravalent metal element in thefirst liquid is preferably at least 0.01 mol/L (where L stands for“liter”, same hereunder). This will yield abrasive grains that allowpolishing of films at an even more superior polishing rate.

The alkaline concentration of the second liquid is preferably notgreater than 15.0 mol/L. This will yield abrasive grains that allowpolishing of films at an even more superior polishing rate.

The pH of the liquid mixture is preferably 2.0 to 7.0. This will yieldabrasive grains that allow polishing of films at an even more superiorpolishing rate.

The tetravalent metal element is preferably tetravalent cerium. Thiswill yield abrasive grains that allow polishing of films at an even moresuperior polishing rate.

In the production method for a slurry according to the invention,abrasive grains obtained by the production method for abrasive grainsdescribed above are mixed with water to obtain a slurry. By using aslurry obtained by this production method, it is possible to accomplishpolishing of films at superior polishing rate compared to a conventionalpolishing liquid.

Also, the production method for a polishing liquid according to theinvention may be one in which a slurry obtained by the production methodfor a slurry described above is mixed with an additive to obtain apolishing liquid. The production method for a polishing liquid accordingto the invention may also be one in which abrasive grains obtained bythe production method for abrasive grains described above, an additiveand water are mixed to obtain a polishing liquid. By using a polishingliquid obtained by these production methods, it is possible toaccomplish polishing of films at a superior polishing rate compared toconventional polishing liquids, while maintaining the effects of addingadditives.

Advantageous Effects of Invention

According to the invention, it is possible to provide abrasive grainsand a slurry that allow polishing of films at a superior polishing ratecompared to the prior art. Moreover, according to the invention, it ispossible to provide a polishing liquid (CMP polishing solution) thatallows polishing of films at a superior polishing rate compared toconventional polishing liquids, while maintaining the effects of addingadditives.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic diagram showing the aggregated condition ofabrasive grains when an additive has been added.

FIG. 2 is a schematic diagram showing the aggregated condition ofabrasive grains when an additive has been added.

FIG. 3 is a figure showing the relationship between absorbance for lightwith a wavelength of 290 nm and polishing rate.

FIG. 4 is a figure showing the relationship between absorbance for lightwith a wavelength of 400 nm and polishing rate.

FIG. 5 is a figure showing the relationship between parameter Z andpolishing rate.

FIG. 6 is a figure showing the relationship between parameter Z andabsorbance for light with a wavelength of 290 nm.

FIG. 7 is a figure showing the relationship between parameter Z andabsorbance for light with a wavelength of 400 nm.

DESCRIPTION OF EMBODIMENTS

Embodiments of the invention will now be described in detail. Theinvention is not limited to the described embodiments, and may becarried out with various modifications such as are within the scope ofthe gist thereof. The “slurry” and “polishing liquid”, for the purposeof the invention, are the composition that contacts the film to bepolished during polishing, and they comprise at least water and abrasivegrains. Also, an aqueous dispersion with a content of the abrasivegrains adjusted to a prescribed value is a solution comprising theprescribed amount of abrasive grains and water.

<Granulation of Abrasive Grains>

The abrasive grains of this embodiment include a tetravalent metalelement hydroxide and are granulated under specific conditions. Abrasivegrains including a tetravalent metal element hydroxide are formed bymixing a metal salt aqueous solution (first liquid) of a salt of atetravalent metal element (metal salt), with an alkali solution (secondliquid). This will allow particles with extremely fine particle sizes tobe obtained, so that abrasive grains with an excellent effect ofreducing scratches can be obtained. A method for obtaining abrasivegrains including a tetravalent metal element hydroxide is disclosed inPatent document 4, for example. Examples of tetravalent metal elementsalts, where M is the metal, include M(SO₄)₂, M(NH₄)₂(NO₃)₆ andM(NH₄)₄(SO₄)₄. Such salts may be used as a single type alone or incombinations of two or more types.

From the viewpoint of a gentler rise in pH, the metal salt concentrationof the tetravalent metal element salt in the metal salt aqueous solutionis preferably 0.010 mol/L or greater, more preferably 0.020 mol/L orgreater and even more preferably 0.030 mol/L or greater, based on thetotal metal salt aqueous solution. There is no particular restriction onthe upper limit for the metal salt concentration of the tetravalentmetal element salt, but for easier manageability, it is preferably notgreater than 1.000 mol/L based on the total metal salt aqueous solution.

The alkali (base) of the alkali solution (such as an aqueous alkalisolution) is not particularly restricted, but specific examples includeorganic bases such as ammonia, triethylamine, pyridine, piperidine,pyrrolidine, imidazole and chitosan and inorganic bases such aspotassium hydroxide and sodium hydroxide. Such bases may be used as asingle type alone or in combinations of two or more types.

From the viewpoint of further inhibiting rapid reaction and increasingthe absorbance for light with a wavelength of 400 nm and with awavelength of 290 nm, explained hereunder, the alkali solutionpreferably exhibits weak basicity. Of the bases mentioned above,nitrogen-containing heterocyclic organic bases are preferred, pyridine,piperidine, pyrrolidine and imidazole are more preferred, and pyridineand imidazole are even more preferred.

From the viewpoint of a gentler rise in pH, the alkaline concentrationof the alkali solution is preferably not greater than 15.0 mol/L, morepreferably not greater than 12.0 mol/L and even more preferably notgreater than 10.0 mol/L, based on the total alkali solution. There is noparticular restriction on the lower limit for the alkali solution, butfrom the viewpoint of productivity, it is preferably at least 0.001mol/L based on the total alkali solution.

The alkaline concentration of the alkali solution is preferably adjustedas appropriate depending on the type of alkali selected. For example,for an alkali with a pKa in the range of 20 or greater, the alkalineconcentration is preferably not greater than 0.1 mol/L, more preferablynot greater than 0.05 mol/L and even more preferably not greater than0.01 mol/L based on the total alkali solution, from the viewpoint of agentler rise in pH. There is no particular restriction on the lowerlimit for the alkali solution, but from the viewpoint of productivity,it is preferably at least 0.001 mol/L based on the total alkalisolution.

For an alkali with a pKa in the range of 12 or greater and less than 20,the alkaline concentration is preferably not greater than 1.0 mol/L,more preferably not greater than 0.5 mol/L and even more preferably notgreater than 0.1 mol/L based on the total alkali solution, from theviewpoint of a gentler rise in pH. There is no particular restriction onthe lower limit for the alkali solution, but from the viewpoint ofproductivity, it is preferably at least 0.01 mol/L based on the totalalkali solution.

For an alkali with a pKa in the range of less than 12, the alkalineconcentration is preferably not greater than 15.0 mol/L, more preferablynot greater than 10.0 mol/L and even more preferably not greater than5.0 mol/L based on the total alkali solution, from the viewpoint of agentler rise in pH. There is no particular restriction on the lowerlimit for the alkali solution, but from the viewpoint of productivity,it is preferably at least 0.1 mol/L based on the total alkali solution.

Specific examples of alkalis with pKa values in these ranges include1,8-diazabicyclo[5.4.0]undec-7-ene (pKa: 25) as an alkali with a pKa of20 or greater, potassium hydroxide (pKa: 16) and sodium hydroxide (pKa:13) as alkalis with a pKa of 12 or greater and less than 20, and ammonia(pKa: 9) and imidazole (pKa: 7) as alkalis with a pKa of less than 12.The pKa value of the alkali used is restricted by adjustment to anappropriate concentration, without being particularly limited thereto.

The absorbance for light with a wavelength of 400 nm or with awavelength of 290 nm, and the light transmittance for light with awavelength of 500 nm, explained hereunder, can be altered by controllingthe starting concentrations of the metal salt aqueous solution and thealkali solution. Specifically, the absorbance and light transmittancetend to be higher with reduced progression of the reaction between theacid and alkali per unit time, and for example, the absorbance and lighttransmittance tend to be higher with increased concentration of themetal salt aqueous solution, while the absorbance and lighttransmittance tend to be higher with reduced concentration of the alkalisolution.

The pH of the liquid mixture obtained by mixing the metal salt aqueoussolution and alkali solution is preferably 2.0 or higher, morepreferably 3.0 or higher and even more preferably 4.0 or higher in thestable state after mixing the metal salt aqueous solution and the alkalisolution, from the viewpoint of stability of the liquid mixture. The pHof the liquid mixture is preferably not higher than 7.0, more preferablynot higher than 6.5 and even more preferably not higher than 6.0 fromthe viewpoint of stability of the liquid mixture.

The pH of the liquid mixture can be measured with a pH meter (forexample, a Model PH81 by Yokogawa Electric Corp.). The pH is measured byplacing an electrode in the liquid to be measured after 2-pointcalibration using standard buffer (phthalate pH buffer: pH 4.01 (25°C.), neutral phosphate pH buffer: pH 6.86 (25° C.)), and then measuringthe value upon stabilization after an elapse of 2 minutes or more.

The abrasive grains including the tetravalent metal element hydroxideare obtained by mixing the metal salt aqueous solution and the alkalisolution under conditions such that parameter Z represented by followingformula (1a) is 5.00 or greater, to react the tetravalent metal elementsalt of the metal salt aqueous solution with the base of the alkalisolution. During mixing of the both liquids, the liquid mixture obtainedby mixing the metal salt aqueous solution and the alkali solution may bestirred using a stirring blade that rotates on a rotating shaft.

Z=[1/(ΔpH×k)]×(N/M)/1000  (1a)

[In formula (1), ΔpH represents the variation in pH per minute in thereaction system, k represents the reaction temperature coefficientrepresented by the following formula (2), N represents the cycle count(min⁻¹), and M represents the substitution count (min⁻¹) represented bythe following formula (5).]

k=2^([(T-20)/10])  (2)

[In formula (2), T represents the temperature (° C.) of the reactionsystem.]

M=v/Q  (5)

[In formula (5), v represents the mixing rate (m³/min) of the firstliquid and second liquid, and Q represents the liquid volume (m³) of theliquid mixture.]

The parameter Z may be represented by following formula (1).

Z=[1/(ΔpH×k)]×(N/M)/1000  (1)

[In formula (1), ΔpH represents the variation in pH per minute in thereaction system, k represents the reaction temperature coefficientrepresented by the following formula (2), N represents the cycle count(min⁻¹) represented by the following formula (3), and M represents thesubstitution count (min⁻¹) represented by the following formula (5).]

k=2^([(T-20)/10])  (2)

[In formula (2), T represents the temperature (° C.) of the reactionsystem.]

N=(u×S)/Q  (3)

[In formula (3), u represents the linear speed (m/min) represented bythe following formula (4), for a stirring blade stirring the liquidmixture obtained by mixing the metal salt aqueous solution and thealkali solution, S represents the area (m²) of the stirring blade, and Qis represents the liquid volume (m³) of the liquid mixture.]

u=2π×R×r  (4)

[In formula (4), R represents the rotational speed (min⁻¹) of thestirring blade, and r represents the radius of rotation (m) of thestirring blade.]

M=v/Q  (5)

[In formula (5), v represents the mixing rate (m³/min) of the metal saltaqueous solution and the alkali solution, and Q represents the liquidvolume (m³) of the liquid mixture.]

Abrasive grains obtained by this production method can satisfy condition(a) below while also satisfying either or both of condition (b) andcondition (c).

(a) The abrasive grains produce light transmittance of 50%/cm or greaterfor light with a wavelength of 500 nm in an aqueous dispersion with acontent of the abrasive grains adjusted to 1.0 mass %.

(b) The abrasive grains produce absorbance of 1.50 or greater for lightwith a wavelength of 400 nm in an aqueous dispersion with a content ofthe abrasive grains adjusted to 1.0 mass %.

(c) The abrasive grains produce absorbance of 1.000 or greater for lightwith a wavelength of 290 nm in an aqueous dispersion with a content ofthe abrasive grains adjusted to 0.0065 mass % (65 ppm).

The present inventors have found that by using abrasive grains thatsatisfy condition (a) of producing light transmittance of 50%/cm orgreater for light with a wavelength of 500 nm, while also satisfyingeither or both condition (b) relating to absorbance for light with awavelength of 290 nm and/or condition (c) relating to absorbance forlight with a wavelength of 400 nm, it is possible to accomplishpolishing of films at superior polishing rate compared to the prior art,and have also found a production method for abrasive grains exhibitingsuch properties. The present inventors further found that a polishingliquid and slurry satisfying these conditions have a slight yellowishtint as observed visually, and that a greater degree of yellowishness ofthe polishing liquid and slurry is linked to improved polishing rate.

(Parameter Z)

Based on study, the present inventors have found that abrasive grainsthat allow polishing of films at superior polishing rate can be obtainedby promoting moderate and uniform reaction between a metal salt aqueoussolution and an alkali solution during production of the abrasivegrains. On the basis of this knowledge, the present inventors found thatit is possible to produce abrasive grains that allow polishing of filmsat superior polishing rate compared to the prior art, by controllingparameter Z which is set by the prescribed parameters of formula (1).Specifically, such abrasive grains can be produced by adjusting eachparameter of formula (1) for a large parameter Z.

The present inventors set parameter Z of formula (1) based on thisknowledge. The components of formula (1) will be considered in thefollowing two separate parts for explanation of formula (1).

(a): [1/(ΔpH×k)]

(b): (N/M)

Component (a) is set as the index relating primarily to reactivity inthe synthesis. As a result of studying each parameter, it is conjecturedthat a small value is preferred for ΔpH, which is the variation in pHper unit time (1 minute) in the reaction system, with a smaller ΔpHresulting in more moderate progress of the reaction. Therefore, ΔpH wasset to be in the denominator in formula (1).

Based on study, the present inventors also found that a low reactionsystem temperature T is preferred, and that a small reaction temperaturecoefficient k, represented by formula (2), is preferred. A smallerreaction temperature coefficient k, i.e. a lower temperature T, isconjectured to result in more moderate progress of the reaction.Therefore, k was set to be in the denominator in formula (1).

On the other hand, component (b) was set as an index relating primarilyto reactivity in the synthesis and diffusibility of the solution. Thecycle count N is dependent on the linear speed u of the stirring blade,the area S of the stirring blade that stirs the liquid mixture and theliquid volume Q of the liquid mixture, in formula (3), while the linearspeed u is dependent on the rotational speed R of the stirring blade andthe radius of rotation r in formula (4). The cycle count N is an indexrepresenting the degree of the speed of diffusion when two or moresubstances are mixed. As a result of study, it is conjectured that alarge cycle count N is preferred, with a larger cycle count N resultingin more uniform mixture of the metal salt aqueous solution and alkalisolution, and more uniform progression of the reaction. Therefore, N wasset to be in the numerator in formula (1).

Also, the substitution count M is dependent on the mixing rate v and theliquid volume Q of the liquid mixture in formula (5). The substitutioncount M is an index representing the rate of substitution of a substanceA to a different substance B, when substance A and substance B aremixed. As a result of study, it is conjectured that a small substitutioncount M is preferred, with a smaller substitution count M resulting inmore moderate progression of the reaction. Therefore, M was set to be inthe denominator in formula (1).

It is thought that the parameters set by (a) and (b) contribute togetherrather than individually to the reactivity of production reaction of thetetravalent metal element hydroxide, and to the diffusibility of thereactants. Since they are considered to act synergistically instead ofmerely additively, the product of (a) and (b) are represented in formula(1). Finally, the product of (a) and (b) is divided by 1000 forconvenience to yield formula (1) as parameter Z.

The lower limit for parameter Z is 5.00 or greater, preferably 10.00 orgreater, more preferably 20.00 or greater, even more preferably 30.00 orgreater, especially more preferably 50.00 or greater and extremelypreferably 100.00 or greater, from the viewpoint of obtaining abrasivegrains that allow polishing of films at superior polishing rate comparedto conventional abrasive grains. The upper limit for parameter Z is notparticularly restricted, but is preferably not greater than 5000.00 fromthe viewpoint of productivity.

By controlling each parameter in formula (1), it is possible to adjustparameter Z to a prescribed value. Each parameter used to adjustparameter Z will now be explained in further detail.

(Variation in pH: ΔpH)

The variation in pH is the average value of the change in pH per unittime (1 minute) from the start of mixing of the metal salt aqueoussolution and alkali solution until the pH of the liquid mixturestabilizes to a constant pH. By controlling ΔpH, which is the variationin pH per unit time (hereunder referred to simply as “ΔpH”), it ispossible to increase the value of parameter Z. Specifically, minimizingΔpH tends to increase the value of parameter Z. The specific means forachieving this may be increasing the metal salt concentration of themetal salt aqueous solution, lowering the alkaline concentration of thealkali solution, or using a weak base as the base for the alkalisolution.

The upper limit for ΔpH is preferably not greater than 5.00, morepreferably not greater than 1.00, even more preferably not greater than0.50 and especially preferably not greater than 0.10, per unit time,from the viewpoint of further preventing rapid reaction. The lower limitfor ΔpH is not particularly restricted, but from the viewpoint ofproductivity, it is preferably at least 0.001 per unit time.

(Reaction Temperature: T)

By controlling the reaction temperature for synthesis (the temperatureof the reaction system, the synthesis temperature) T, it is possible toincrease parameter Z. Specifically, lowering the reaction temperature T,i.e. reducing the reaction temperature coefficient k, tends to increasethe value of parameter Z.

The reaction temperature T is preferably within the range of 0-60° C.,as the temperature in the reaction system read upon placing athermometer in the reaction system (liquid mixture). The upper limit forthe reaction temperature T is preferably not higher than 60° C., morepreferably not higher than 50° C., even more preferably not higher than40° C., especially preferably not higher than 30° C. and especiallypreferably not higher than 25° C., from the viewpoint of furtherpreventing rapid reaction. From the viewpoint of facilitatingprogression of the reaction, the lower limit for the reactiontemperature T is preferably 0° C. or higher, more preferably 5° C. orhigher, even more preferably 10° C. or higher, especially morepreferably 15° C. or higher and extremely preferably 20° C. or higher.

The tetravalent metal element salt in the metal salt aqueous solutionand the base of the alkali solution are preferably reacted at a fixedreaction temperature T (for example, in a temperature range of reactiontemperature T±3° C.). The method of adjusting the reaction temperatureis not particularly restricted, and for example, it may be a method inwhich a container holding either the metal salt aqueous solution or thealkali solution is placed in a water tank filled with water, and themetal salt aqueous solution and alkali solution are mixed whileadjusting the water temperature of the water tank using a CoolnicsCirculator (product name: Cooling Thermopump CTP101 by Eyela) as theexternal circulation apparatus.

(Cycle Count: N)

The lower limit for the cycle count N is preferably 1.00 min⁻¹ orgreater, more preferably 10.00 min⁻¹ or greater and even more preferably50.00 min⁻¹ or greater, from the viewpoint of further preventing localbias of the reaction. The upper limit for the cycle count N is notparticularly restricted, but is preferably not greater than 200.00 min⁻¹from the viewpoint of preventing splashing of liquid during production.

(Linear Speed u)

The linear speed is the flow rate of fluid per unit time (1 minute) andunit area (m²), and it is an index for diffusion of a substance. Thelinear speed u for this embodiment is the linear speed of the stirringblade during mixing of the metal salt aqueous solution and the alkalisolution. By controlling the linear speed, it is possible to increaseparameter Z. Specifically, increasing the linear speed u tends toincrease the value of parameter Z.

The lower limit for the linear speed u is preferably 5.00 μl/min orgreater, more preferably 10.00 m/min or greater, even more preferably20.00 m/min or greater, especially more preferably 50.00 m/min orgreater and extremely preferably 70.00 m/min or greater, from theviewpoint of further preventing the substance from failing to thoroughlydiffuse, which results in its localization and non-uniformity of thereaction. The upper limit for the linear speed u is not particularlyrestricted, but is preferably not greater than 200.00 m/min from theviewpoint of preventing splashing of liquid during production.

(Area of Stirring Blade: S)

The area S of the stirring blade which stirs the liquid mixture is thesurface area of one side of the stirring blade, and in the case ofmultiple stirring blades, it is the total area of all of the stirringblades. By controlling the area S, it is possible to increase parameterZ. Specifically, increasing the area S tends to increase the value ofparameter Z.

The area S is adjusted according to the size of the liquid volume Q ofthe liquid mixture. For example, when the liquid volume Q of the liquidmixture is 0.001 to 0.005 m³, the area S is preferably 0.0005 to 0.0010m².

(Liquid Volume of Liquid Mixture: Q)

The liquid volume Q of the liquid mixture is the total volume of themetal salt aqueous solution and the alkali solution. In formula (1), theliquid volume Q included in the cycle count N and the liquid volume Qincluded in the substitution count M cancel each other out, and theparameter Z almost tends not to depend on the value of the liquid volumeQ. The liquid volume Q is 0.001 to 10.00 m³, for example.

(Rotational Speed of Stirring Blade: R)

By controlling the rotational speed R, it is possible to increaseparameter Z. Specifically, increasing the rotational speed R tends toincrease the value of parameter Z.

The lower limit for the rotational speed R is preferably 30 min⁻¹ orgreater, more preferably 100 min⁻¹ or greater and even more preferably300 min⁻¹ or greater, from the viewpoint of mixing efficiency. The upperlimit for the rotational speed R is not particularly restricted, and itwill need to be appropriately adjusted depending on the size and shapeof the stirring blade, but it is preferably not greater than 1000 min⁻¹from the viewpoint of preventing splashing of liquid during production.

(Radius of Rotation of Stirring Blade: r)

By controlling the radius of rotation r, it is possible to increaseparameter Z. Specifically, increasing the radius of rotation r tends toincrease the value of parameter Z.

The lower limit for the radius of rotation r is preferably 0.001 m orgreater, more preferably 0.01 m or greater and even more preferably 0.1m or greater, from the viewpoint of stirring efficiency. The upper limitfor the radius of rotation r is not particularly restricted, but ispreferably not greater than 10 m from the viewpoint of facilitatinghandling. In the case of multiple stirring blades, the average value ofthe radius of rotation is preferably within the aforementioned range.

(Substitution Count M)

By controlling the substitution count M, it is possible to increaseparameter Z. Specifically, decreasing the substitution count M tends toincrease the value of parameter Z.

The upper limit for the substitution count M is preferably not greaterthan 1.0 min⁻¹, more preferably not greater than 1.0×10⁻¹ min⁻¹, evenmore preferably not greater than 2.0×10⁻² min⁻¹, especially morepreferably not greater than 1.0×10⁻² min⁻¹ and extremely preferably notgreater than 1.0×10⁻³ min⁻¹, from the viewpoint of further preventingrapid progression of the reaction. The lower limit for the substitutioncount M is not particularly restricted, but is preferably 1.0×10⁻⁵ min⁻¹or greater from the viewpoint of productivity.

(Mixing Rate: v)

The mixing rate v is the supply rate of solution A, which is either themetal salt aqueous solution or the alkali solution, when solution A issupplied to the other solution B. By controlling the mixing rate v, itis possible to increase parameter Z. Specifically, lowering the mixingrate v tends to increase the value of parameter Z.

The upper limit for the mixing rate v is preferably not greater than1.00×10⁻² m³/min, more preferably not greater than 1.00×10⁻³ m³/min,even more preferably not greater than 1.00×10⁻⁴ m³/min and especiallypreferably not greater than 5.00×10⁻⁶ m³/min, from the viewpoint offurther preventing rapid progression of the reaction and furtherpreventing local bias of the reaction. The lower limit for the mixingrate v is not particularly restricted, but is preferably 1.00×10⁻⁷m³/min or greater from the viewpoint of productivity.

Abrasive grains including a tetravalent metal element hydroxide producedin the manner described above may include impurities, and the impuritiesmay be removed. The method for removing the impurities is notparticularly restricted, and for example, methods such as centrifugalseparation, filter press and ultrafiltration may be mentioned. This canadjust the absorbance for light with a wavelength of 450-600 nm,explained hereunder. The reaction mixture obtained by reaction betweenthe metal salt aqueous solution and alkali solution comprises abrasivegrains including a tetravalent metal element hydroxide, and the reactionmixture may be used for polishing of a film to be polished.

<Production of Slurry>

The production method for a slurry according to this embodimentcomprises an abrasive grain producing step in which a metal salt aqueoussolution and an alkali solution are mixed under the aforementionedconditions to obtain the abrasive grains, and a slurry producing step inwhich the abrasive grains obtained by the abrasive grain producing stepare mixed with water to obtain a slurry. In the slurry producing step,the abrasive grains are dispersed in water. The method of dispersing theabrasive grains in water is not particularly restricted, and specificexamples include stirring, a homogenizer, an ultrasonic disperser, a wetball mill, or the like. A slurry may also be obtained by mixing abrasivegrains obtained in the abrasive grain producing step, another type ofabrasive grains, and water.

<Production of Polishing Liquid>

The production method for a polishing liquid may be one comprising aslurry producing step in which a slurry is obtained by the productionmethod for a slurry described above, and a polishing liquid preparationstep in which a polishing liquid is obtained by mixing the slurry and anadditive. In this case, there may be prepared a two-pack type polishingliquid separately comprising a slurry containing abrasive grains and anadditive solution containing an additive, and the slurry and additivesolution may be mixed to obtain a polishing liquid. The productionmethod for a polishing liquid may also be one comprising theaforementioned abrasive grain producing step, and a polishing liquidpreparation step in which a polishing liquid is obtained by mixingabrasive grains obtained in the abrasive grain producing step, anadditive, and water. In this case, there may be mixed the abrasivegrains obtained in the abrasive grain producing step, another type ofabrasive grains, and water.

<Polishing Liquid>

The polishing liquid of this embodiment comprises at least abrasivegrains, an additive and water. Each of these constituent components willnow be explained.

(Abrasive Grains)

The abrasive grains include a tetravalent metal element hydroxide. Thetetravalent metal element is preferably a rare earth element, and fromthe viewpoint of facilitating formation of a hydroxide suitable forpolishing, it is more preferably at least one kind selected from thegroup consisting of scandium, yttrium, lanthanum, cerium, praseodymium,neodymium, promethium, gadolinium, terbium, dysprosium, holmium, erbium,thulium, ytterbium and lutetium. The tetravalent metal element is evenmore preferably cerium, from the viewpoint of ready availability and amore superior polishing rate.

The abrasive grains are preferably composed of a tetravalent metalelement hydroxide, and from the viewpoint of high chemical activity anda more superior polishing rate, they are more preferably composed of ahydroxide of tetravalent cerium. The polishing liquid of this embodimentmay also combine other types of abrasive grains, within ranges that donot impair the properties of the abrasive grains including thetetravalent metal element hydroxide. Specifically, abrasive grains ofsilica, alumina or zirconia, for example, may be used.

The content of the tetravalent metal element hydroxide in the abrasivegrains is preferably 50 mass % or greater, more preferably 60 mass % orgreater, even more preferably 70 mass % or greater, especially morepreferably 80 mass % or greater and extremely preferably 90 mass % orgreater, based on the total mass of the abrasive grains.

Of the constituent components of the polishing liquid of thisembodiment, the tetravalent metal element hydroxide is believed to havea major effect on the polishing properties. Thus, adjusting the contentof the tetravalent metal element hydroxide can improve chemicalinteraction between the abrasive grains and surface to be polished, andfurther improve the polishing rate. Specifically, the content of thetetravalent metal element hydroxide is preferably 0.01 mass % orgreater, more preferably 0.05 mass % or greater and even more preferably0.1 mass % or greater based on the total mass of the polishing liquid,from the viewpoint of helping to sufficiently exhibit the function ofthe tetravalent metal element hydroxide. In addition, the content of thetetravalent metal element hydroxide is preferably not greater than 8mass % and more preferably not greater than 5 mass % based on the totalmass of the polishing liquid, from the viewpoint of helping to avoidaggregation of the abrasive grains.

The abrasive grain content is not particularly restricted, but from theviewpoint of helping to avoid aggregation of the abrasive grains andallowing the abrasive grains to effectively act on the surface to bepolished to smoothly promote polishing, it is preferably 0.01-10 mass %and more preferably 0.1-5 mass % based on the total mass of thepolishing liquid.

The mean secondary particle size of the abrasive grains (hereunderreferred to as “mean particle size”, unless otherwise specified) ispreferably 1-200 nm from the viewpoint of obtaining a more superiorpolishing rate. Since a smaller mean particle size to some extentincreases the specific surface area of the abrasive grains that contactwith the surface to be polished, and thus allowing the polishing rate tofurther improved, the mean particle size is more preferably not greaterthan 150 nm, even more preferably not greater than 100 nm, especiallymore preferably not greater than 80 nm and extremely preferably notgreater than 50 nm. Since a larger mean particle size to some extenttends to facilitate increase in the polishing rate, the lower limit forthe mean particle size is more preferably at least 2 nm and even morepreferably at least 5 nm.

The mean particle size of the abrasive grains can be measured with aparticle size distribution meter based on the photon correlation method,and specifically, it may be measured using a Zetasizer 3000HS by MalvernInstruments Ltd. or an N5 by Beckman Coulter, Inc., for example.Specifically, in a measuring method using an N5, for example, an aqueousdispersion with a content of the abrasive grains adjusted to 0.2 mass %is prepared, approximately 4 mL of the aqueous dispersion is poured intoa 1 cm-square cell, and the cell is placed in the apparatus. Measurementis conducted at 25° C. with a dispersing medium refractive index of 1.33and a viscosity of 0.887 mPa·s, and the value of the mean particle sizeof the abrasive grains is obtained.

[Absorbance]

It is not necessarily fully understood why an effect of improvingpolishing rate is obtained by using abrasive grains that produceabsorbance of 1.50 or greater for light with a wavelength of 400 nm inan aqueous dispersion with a content of the abrasive grains adjusted to1.0 mass %, but the present inventors conjecture as follows.Specifically, depending on the conditions for production of thetetravalent metal element hydroxide (M(OH)₄), it is believed thatparticles of M(OH)₃X, composed of a tetravalent metal (M⁴⁺), 3 hydroxylgroups (OH⁻) and one anion (X⁻), are produced for some of the abrasivegrains. In M(OH)₃X, the electron-withdrawing anion (X⁻) acts to improvethe reactivity of the hydroxyl groups, and an increasing abundance ofM(OH)₃X is thought to lead to improved polishing rate. Also, the M(OH)₃Xparticles absorb light with a wavelength of 400 nm, and an increasedabundance of M(OH)₃X presumably causes increased absorbance for lightwith a wavelength of 400 nm, and improves the polishing rate.

The absorption peak of M(OH)₃X at a wavelength of 400 nm has beenconfirmed to be much lower than the absorption peak at a wavelength of290 nm. In this regard, as a result of studying degrees of absorbanceusing aqueous dispersions with relatively high abrasive grain contentsof 1.0 mass %, which allow absorbance to be easily detected as highabsorbance, the present inventors have found that the effect ofimproving polishing rate is superior when using abrasive grains thatproduce absorbance of 1.50 or greater for light with a wavelength of 400mm in the aqueous dispersion.

The absorbance for light with a wavelength of 400 nm is preferably 1.50or greater, more preferably 2.00 or greater, even more preferably 2.50or greater and especially preferably 3.00 or greater, from the viewpointof allowing polishing of films at an even more superior polishing rate.The upper limit for the absorbance for light with a wavelength of 400 nmis not particularly restricted, but is preferably 10.00, for example, asthe detection limit of the measuring apparatus. Incidentally, since itis thought that the absorbance for light with a wavelength of 400 nmderives from the abrasive grains, as explained above, naturally it wouldnot be possible to polish a film at a superior polishing rate with apolishing liquid comprising a substance (such as a pigment componentexhibiting a yellow color) that produces absorbance of 1.50 or greaterfor light with a wavelength of 400 nm, instead of abrasive grains thatproduce absorbance of 1.50 or greater for light with a wavelength of 400nm.

It is not necessarily fully understood why an effect of improvingpolishing rate is obtained by using abrasive grains that produceabsorbance of 1.000 or greater for light with a wavelength of 290 nm inan aqueous dispersion with a content of the abrasive grains adjusted to0.0065 mass % (65 ppm), but the present inventors conjecture as follows.Specifically, particles of M(OH)₃X that are produced depending on theproduction conditions for the tetravalent metal element hydroxide(M(OH)₄) have a calculated absorption peak at a wavelength of about 290nm, and for example, particles composed of Ce⁴⁺(OH⁻)₃NO₃ ⁻ have anabsorption peak at a wavelength of 290 nm. Consequently, it is believedthat the polishing rate is improved in accordance with the increase inabsorbance for light with a wavelength of 290 μm due to the increase inthe abundance of M(OH)₃X.

The absorbance for light with a wavelength of about 290 nm tends to bedetected to a greater degree as the measuring limit is exceeded. In thisregard, as a result of studying degrees of absorbance using aqueousdispersions with relatively low abrasive grain contents of 0.0065 mass%, which allow absorbance to be easily detected as low absorbance, thepresent inventors have found that the effect of improving polishing rateis superior when using abrasive grains that produce absorbance of 1.000or greater for light with a wavelength of 290 nm in the aqueousdispersion. The present inventors have also found that, apart from lightwith a wavelength of about 400 nm, which when absorbed by an absorbingsubstance tends to cause the absorbing substance to exhibit a yellowcolor, higher absorbance of abrasive grains for light with a wavelengthof about 290 nm produces deeper yellowishness in a polishing liquid orslurry employing such abrasive grains.

The absorbance for light with a wavelength of 290 nm is preferably 1.000or greater, more preferably 1.050 or greater, even more preferably 1.100or greater, especially more preferably 1.200 or greater and extremelypreferably 1.300 or greater, from the viewpoint of allowing polishing offilms at an even more superior polishing rate. The upper limit for theabsorbance for light with a wavelength of 290 nm is not particularlyrestricted, but is preferably 10.00, for example, as the detection limitof the apparatus.

From the viewpoint of polishing of films at an even more superiorpolishing rate with a polishing liquid of this embodiment, the abrasivegrains are preferably ones that produce absorbance of 1.50 or greaterfor light with a wavelength of 400 nm in an aqueous dispersion with acontent of the abrasive grains adjusted to 1.0 mass %, while alsoproducing absorbance of 1.000 or greater for light with a wavelength of290 nm in an aqueous dispersion with a content of the abrasive grainsadjusted to 0.0065 mass %.

Also, the aforementioned metal hydroxides (M(OH)₄ and M(OH)₃X) tend notto exhibit absorption for light with wavelengths of 450 nm and greater,and especially for light with wavelengths of 450-600 nm. Therefore, fromthe viewpoint of minimizing adverse effects on polishing by the presenceof impurities, the abrasive grains preferably produce absorbance of notgreater than 0.010 for light with a wavelength of 450-600 nm in anaqueous dispersion with a content of the abrasive grains adjusted to0.0065 mass % (65 ppm). Specifically, the absorbance preferably does notexceed 0.010 for all light within a wavelength range of 450-600 nm in anaqueous dispersion with a content of the abrasive grains adjusted to0.0065 mass %. The absorbance for light with a wavelength of 450-600 nmis more preferably not greater than 0.005 and even more preferably notgreater than 0.001. The lower limit for the absorbance for light with awavelength of 450-600 nm is preferably 0.

The absorbance in an aqueous dispersion can be measured, for example,using a spectrophotometer (model name: U3310) by Hitachi, Ltd.Specifically, an aqueous dispersion with a content of the abrasivegrains adjusted to 0.0065 mass % or 1.0 mass % is prepared as ameasuring sample. Approximately 4 mL of the measuring sample is placedin a 1 cm-square cell, and the cell is set in the apparatus.Spectrophotometry is then conducted in a wavelength range of 200-600 nm,and the absorbance is judged from the obtained chart.

If absorbance of at least 1.000 is exhibited when the absorbance forlight with a wavelength of 290 nm is measured with excessive dilution sothat the abrasive grain content in the measuring sample is lower than0.0065 mass %, it is clear that the absorbance will also be at least1.000 when the abrasive grain content is 0.0065 mass %. Thus, theabsorbance may be screened by measuring the absorbance using an aqueousdispersion excessively diluted so that the abrasive grain content islower than 0.0065 mass %.

Screening of the absorbance may also be accomplished by assuming that ifabsorbance of at least 1.50 is exhibited when the absorbance for lightwith a wavelength of 400 nm is measured with excessive dilution so thatthe abrasive grain content is lower than 1.0 mass %, the absorbance willalso be at least 1.50 when the abrasive grain content is 1.0 mass %.Also, screening of the absorbance may be accomplished by assuming thatif absorbance of not greater than 0.010 is exhibited when the absorbancefor light with a wavelength of 450-600 nm is measured with dilution sothat the abrasive grain content is greater than 0.0065 mass %, theabsorbance will also be not greater than 0.010 when the abrasive graincontent is 0.0065 mass %.

[Light Transmittance]

The polishing liquid of this embodiment preferably has high transparencyfor visible light (it is visually transparent or nearly transparent).Specifically, the abrasive grains of the polishing liquid of thisembodiment preferably produce light transmittance of 50%/cm or greaterfor light with a wavelength of 500 nm in an aqueous dispersion with acontent of the abrasive grains adjusted to 1.0 mass %. This can furtherinhibit reduction in polishing rate by addition of additives, thusmaking it easier to obtain other properties while maintaining polishingrate. From this viewpoint, the light transmittance is more preferably60%/cm or greater, even more preferably 70%/cm or greater, especiallymore preferably 80%/cm or greater and extremely preferably 90%/cm orgreater. The upper limit for the light transmittance is 100%/cm.

Although the reason for which reduction in polishing rate can beinhibited by adjusting the light transmittance of the abrasive grains isnot thoroughly understood, the present inventors conjecture as follows.The action exhibited as abrasive grains by the tetravalent metal elementhydroxide particles, such as cerium hydroxide particles, is thought todepend more on chemical action than on mechanical action. Therefore, thenumber of abrasive grains is believed to contribute to the polishingrate more than the sizes of the abrasive grains.

In the case of low light transmittance in an aqueous dispersion havingan abrasive grain content of 1.0 mass %, the abrasive grains present inthe aqueous dispersion presumably have relatively more particles withlarge particle sizes (hereunder referred to as “coarse particles”). Whenan additive (such as polyvinyl alcohol (PVA)) is added to a polishingliquid comprising such abrasive grains, other particles aggregate aroundthe coarse particles as nuclei, as shown in FIG. 1. As a result, thenumber of abrasive grains acting on the surface to be polished per unitarea (the effective abrasive grain number) is reduced and the specificsurface area of the abrasive grains contacting with the surface to bepolished is reduced, whereby presumably reduction in the polishing rateoccur.

Conversely, in the case of high light transmittance in an aqueousdispersion having an abrasive grain content of 1.0 mass %, the abrasivegrains present in the aqueous dispersion presumably are in the state offewer “coarse particles”. In such cases with a low abundance of coarseparticles, few coarse particles are available as nuclei for aggregation,and therefore aggregation between abrasive grains is inhibited or thesizes of the aggregated particles are smaller than the aggregatedparticles shown in FIG. 1, even when an additive (such as polyvinylalcohol) is added to the polishing liquid, as shown in FIG. 2. As aresult, the number of abrasive grains acting on the surface to bepolished per unit area (the effective abrasive grain number) ismaintained and the specific surface area of the abrasive grainscontacting with the surface to be polished is maintained, wherebypresumably reduction in the polishing rate does not easily occur.

According to research by the present inventors, it was found that evenamong polishing liquids having identical particle sizes to each other asmeasured with a common particle size measuring apparatus, some may bevisually transparent (high light transmittance) and some visually turbid(low light transmittance). This suggests that coarse particles, whichproduce the action described above, contribute to reduced polishing rateeven in slight amounts that cannot be detected with common particle sizemeasuring apparatuses.

It was also found that even repeated filtration to reduce the amount ofcoarse particles does not significantly improve the phenomenon ofreduced polishing rate with addition of additives. The present inventorsfound that this problem can be overcome by using abrasive grains withhigh light transmittance in aqueous dispersion, by modifying theproduction method for the abrasive grains, as explained above.

The light transmittance is the transmittance for light with a wavelengthof 500 nm. The light transmittance is measured with a spectrophotometer,and specifically, it is measured with a U3310 Spectrophotometer(apparatus name) by Hitachi, Ltd., for example.

As a more specific measuring method, an aqueous dispersion with acontent of the abrasive grains adjusted to 1.0 mass % is prepared as ameasuring sample. Approximately 4 mL of the measuring sample is placedin a 1 cm-square cell, the cell is set in the apparatus, and measurementis conducted. If the light transmittance is at least 50%/cm in anaqueous dispersion having an abrasive grain content of greater than 1.0mass %, it is clear that the light transmittance will also be at least50%/cm when the measuring sample is diluted to 1.0 mass %. Therefore,using an aqueous dispersion with an abrasive grain content of greaterthan 1.0 mass % allows screening of the light transmittance by aconvenient method.

(Additives)

The polishing liquid of this embodiment allows an especially highpolishing rate to be obtained for inorganic insulating films (forexample, silicon oxide films), and is therefore especially suitable forpolishing of substrates with inorganic insulating films. Also, byappropriate selection of additives, the polishing liquid of thisembodiment can provide a high level of both polishing rate and polishingproperties other than polishing rate.

An additive that is used may be a known additive without any particularrestrictions, such as a dispersing agent that increases thedispersibility of the abrasive grains, a polishing rate improver thatimproves the polishing rate, a flattening agent (a flattening agent thatreduces irregularities on the polished surface after polishing, or aglobal flattening agent that improves the global flatness of thesubstrate after polishing), or a selection ratio improver that improvesthe polishing selective ratio of the inorganic insulating film withrespect to stopper films such as silicon nitride films or polysiliconfilms.

Examples of dispersing agents include vinyl alcohol polymers and theirderivatives, betaine, lauryl betaine, lauryldimethylamine oxide, and thelike. Examples of polishing rate improvers include β-alanine betaine,stearyl betaine, and the like. Examples of flattening agents that reduceirregularities on polished surfaces include ammonium lauryl sulfate,triethanolamine polyoxyethylene alkyl ether sulfate, and the like.Examples of global flattening agents include polyvinylpyrrolidone,polyacrolein, and the like. Examples of selection ratio improversinclude polyethyleneimine, polyallylamine, chitosan, and the like. Thesemay be used alone or in combinations of two or more.

The polishing liquid of this embodiment preferably comprises a vinylalcohol polymer or a derivative thereof as an additive. However, vinylalcohol, which is a monomer of polyvinyl alcohol, generally tends not toexist alone as stable compounds Therefore, polyvinyl alcohol is usuallyobtained by polymerization of a vinyl carboxylate monomer such as vinylacetate monomer to obtain poly(vinyl carboxylate), followed bysaponification (hydrolysis). Thus, a vinyl alcohol polymer obtainedusing vinyl acetate monomer as the starting material, for example, has—OCOCH₃ and hydrolyzed —OH groups as functional groups in the molecule,and the proportion of —OH groups is defined as the saponificationdegree. That is, a vinyl alcohol polymer whose saponification degree isnot 100% has a structure which is essentially a copolymer of vinylacetate and vinyl alcohol. It may also be one in which a vinylcarboxylate monomer such as vinyl acetate monomer and another vinylgroup-containing monomer (for example, ethylene, propylene, styrene orvinyl chloride) are copolymerized, and all or some of the portionsderived from the vinyl carboxylate monomer are saponified. In theinvention, all of these are collectively referred to as “vinyl alcoholpolymers”, and a “vinyl alcohol polymer” is ideally a polymer having thefollowing structural formula.

(wherein n represents a positive integer)

A “derivative” of a vinyl alcohol polymer is defined as a term includinga derivative of a homopolymer of vinyl alcohol (that is, a polymer witha saponification degree of 100%), and derivatives of copolymers of vinylalcohol monomer and other vinyl monomers (for example, ethylene,propylene, styrene, vinyl chloride or the like). Examples of suchderivatives include polymers having a portion of the hydroxyl groupssubstituted with amino, carboxyl, ester groups or the like, and polymershaving a portion of the hydroxyl groups modified. Examples of suchderivatives include reactive polyvinyl alcohols (for example, GOHSEFIMER(registered trademark) Z by Nippon Synthetic Chemical Industry Co.,Ltd.), cationized polyvinyl alcohols (for example, GOHSEFIMER(registered trademark) K by Nippon Synthetic Chemical Industry Co.,Ltd.), anionized polyvinyl alcohols (for example, GOHSERAN (registeredtrademark) L and GOHSENOL (registered trademark) T by Nippon SyntheticChemical Industry Co., Ltd.), and hydrophilic group-modified polyvinylalcohols (for example, ECOMATI by Nippon Synthetic Chemical IndustryCo., Ltd.).

As mentioned above, vinyl alcohol polymers and their derivativesfunction as abrasive grain dispersing agents, and have effects ofimproving polishing liquid stability. It is believed that interactionbetween the hydroxyl group of the vinyl alcohol polymer or itsderivative and tetravalent metal element hydroxide particles can inhibitaggregation of the abrasive grains and minimize changes in particle sizeof the abrasive grains in the polishing liquid, thereby improvingstability. Also, by using the vinyl alcohol polymer or its derivative incombination with tetravalent metal element hydroxide particles, it ispossible to increase the polishing selective ratio for inorganicinsulating films (for example, silicon oxide films) with respect tostopper films (for example, silicon nitride films and polysilicon films)(i.e., polishing rate for inorganic insulating films/polishing rate forstopper films). In addition, a vinyl alcohol polymer and its derivativecan also improve the flatness of the polished surface after polishing,and can prevent adhesion of abrasive grains on the polished surface(cleanability improver).

The saponification degree of the vinyl alcohol polymer is preferably notgreater than 95 mol % from the viewpoint of further increasing thepolishing selective ratio for inorganic insulating films with respect tostopper films. From the same viewpoint, the saponification degree ismore preferably not greater than 90 mol %, even more preferably notgreater than 88 mol %, especially preferably not greater than 85 mol %,extremely preferably not greater than 83 mol % and very preferably notgreater than 80 mol %.

There are no particular restrictions on the lower limit for thesaponification degree, but from the viewpoint of excellent solubility inwater, it is preferably at least 50 mol %, more preferably at least 60mol % and even more preferably at least 70 mol %. The saponificationdegree of the vinyl alcohol polymer can be measured according to JIS K6726 (Polyvinyl alcohol test method).

There are no particular restrictions on the upper limit for the meanpolymerization degree (weight-average molecular weight) of the vinylalcohol polymer, but from the viewpoint of further inhibiting reductionin polishing rate for inorganic insulating films (for example, siliconoxide films), it is preferably not greater than 3000, more preferablynot greater than 2000 and even more preferably not greater than 1000.

From the viewpoint of further increasing the polishing selective ratiofor inorganic insulating films with respect to stopper films, the lowerlimit for the mean polymerization degree is preferably at least 50, morepreferably at least 100 and even more preferably at least 150. The meanpolymerization degree of the vinyl alcohol polymer can be measuredaccording to JIS K 6726 (Polyvinyl alcohol test method).

In order to adjust the polishing selective ratio for inorganicinsulating films with respect to stopper films, and the flatness ofpolished substrates, a combination of multiple polymers with differentsaponification degrees or mean polymerization degrees may be used as thevinyl alcohol polymer or its derivative. In such cases, preferably thesaponification degree of at least one vinyl alcohol polymer and itsderivative is not greater than 95 mol %, and from the viewpoint offurther improving the polishing selective ratio, the averagesaponification degree calculated from each saponification degree and themixing ratio is preferably not greater than 95 mol %. The preferredrange for these saponification degrees is the same range specifiedabove.

From the viewpoint of more efficiently obtaining the effects ofadditives, the additive content is preferably 0.01 mass % or greater,more preferably 0.1 mass % or greater and even more preferably 1.0 mass% or greater, based on the total mass of the polishing liquid. From theviewpoint of further inhibiting reduction in the polishing rate forinorganic insulating films, the additive content is preferably notgreater than 10 mass %, more preferably not greater than 5.0 mass % andeven more preferably not greater than 3.0 mass % based on the total massof the polishing liquid.

(Water)

There are no particular restrictions on the water used in the polishingliquid of this embodiment, but deionized water or ultrapure water ispreferred. The water content is not particularly restricted and may bethe remaining portion of the polishing liquid excluding the otherconstituent components.

[Polishing Liquid Properties]

The pH of the polishing liquid is preferably 2.0-9.0, for a satisfactoryrelationship of the surface potential of the abrasive grains withrespect to the surface potential of the surface to be polished, tofacilitate action of the abrasive grains on the surface to be polished,and thereby obtaining a more superior polishing rate. From the viewpointof stabilizing the pH of the polishing liquid and minimizing problemssuch as aggregation of the abrasive grains due to addition of a pHstabilizer, the lower limit for the pH is preferably 2.0 or higher, morepreferably 4.0 or higher and even more preferably 5.0 or higher. Also,from the viewpoint of excellent dispersibility of the abrasive grainsand obtaining a more superior polishing rate, the upper limit for the pHis preferably not higher than 9.0, more preferably not higher than 7.5and even more preferably not higher than 6.5. The pH of the polishingliquid can be measured by the same method as for the pH of the liquidmixture.

Any known pH regulator may be used to adjust the pH of the polishingliquid, without any particular restrictions, and specifically, there maybe used inorganic acids such as phosphoric acid, sulfuric acid or nitricacid, organic acids such as formic acid, acetic acid, propionic acid,maleic acid, phthalic acid, citric acid or succinic acid, amines such asethylenediamine, toluidine, piperazine, histidine or aniline, andnitrogen-containing heterocyclic compounds such as pyridine, imidazole,triazole or pyrazole.

A pH stabilizer is an additive for adjustment to a prescribed pH, and itis preferably a buffer component. The buffer component is preferably acompound with a pKa in the range of ±1.5, and more preferably a compoundwith a pKa in the range of ±1.0, relative to the prescribed pH. Suchcompounds include amino acids such as glycine, arginine, lysine,asparagine, aspartic acid and glutamic acid, amines such asethylenediamine, 2-aminopyridine, 3-aminopyridine, picolinic acid,histidine, piperazine, morpholine, piperidine, hydroxylamine andaniline, nitrogen-containing heterocyclic compounds such as pyridine,imidazole, benzimidazole, pyrazole, triazole and benzotriazole, andcarboxylic acids such as formic acid, acetic acid, propionic acid,malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid,fumaric acid, phthalic acid, citric acid, lactic acid and benzoic acid.

<Slurry>

The slurry of this embodiment may be used directly for polishing, or itmay be used as a slurry in a “two-pack type polishing liquid”, havingthe constituent components of the polishing liquid separated into aslurry and an additive solution. According to this embodiment, thepolishing liquid and the slurry differ in the presence or absence ofadditives, and the polishing liquid is obtained by adding the additivesto the slurry.

The slurry of this embodiment comprises at least the same abrasivegrains as the polishing liquid of this embodiment, and water. Forexample, the abrasive grains include a tetravalent metal elementhydroxide, and the mean secondary particle size of the abrasive grainsis the same as the abrasive grains used in the polishing liquid of thisembodiment.

In the slurry of this embodiment, the abrasive grains satisfy condition(a), while also satisfying either or both of conditions (b) and (c).Also, the abrasive grains preferably produce absorbance of not greaterthan 0.010 for light with a wavelength of 450-600 nm in an aqueousdispersion with a content of the abrasive grains adjusted to 0.0065 mass%. The abrasive grains also preferably produce light transmittance of50%/cm or greater for light with a wavelength of 500 nm in an aqueousdispersion with a content of the abrasive grains adjusted to 1.0 mass %.These preferred ranges and measuring methods for the absorbance andlight transmittance are the same as for the polishing liquid of thisembodiment.

In the slurry of this embodiment, the abrasive grain content is notparticularly restricted, but it is preferably not greater than 15 mass %based on the total mass of the slurry, from the viewpoint of helping toavoid aggregation of the abrasive grains. The abrasive grain content ispreferably 0.01 mass % or greater based on the total mass of the slurry,from the viewpoint of allowing the mechanical effect of the abrasivegrains to be easily obtained.

Of the constituent components of the slurry of this embodiment, thetetravalent metal element hydroxide is believed to have a major effecton the polishing properties. The tetravalent metal element hydroxidecontent is preferably not greater than 10 mass % based on the total massof the slurry, from the viewpoint of helping to avoid aggregation of theabrasive grains, as well as achieving satisfactory chemical interactionwith the surface to be polished and thereby allowing further improvementin the polishing rate. The tetravalent metal element hydroxide contentis preferably 0.01 mass % or greater based on the total mass of theslurry, from the viewpoint of allowing the function of the tetravalentmetal element hydroxide to be adequately exhibited.

The pH of the slurry of this embodiment is preferably 2.0-9.0, for asatisfactory surface potential of the abrasive grains with respect tothe surface potential of the surface to be polished, to facilitateaction of the abrasive grains on the surface to be polished, and therebyobtaining a more superior polishing rate. Also, from the viewpoint ofstabilizing the pH of the slurry and minimizing problems such asaggregation of the abrasive grains due to addition of a pH stabilizer,the lower limit for the pH is preferably at least 2.0, more preferablyat least 2.5 and even more preferably at least 3.0. Furthermore, fromthe viewpoint of excellent dispersibility of the abrasive grains andobtaining a more superior polishing rate, the upper limit for the pH ispreferably not higher than 9.0, more preferably not higher than 7.0 andeven more preferably not higher than 5.0. The pH of the slurry can bemeasured by the same method as for the pH of the liquid mixture.

<Polishing Liquid Set>

According to this embodiment, it is also possible to provide a polishingliquid set that can accomplish polishing of films at a superiorpolishing rate compared to conventional polishing liquids, whilemaintaining the effects of adding additives. In the polishing liquid setof this embodiment, the constituent components of the polishing liquidare separately stored as a slurry and an additive solution, so that theslurry (first liquid) and additive solution (second liquid) are mixed toform the polishing liquid. The slurry used may be the slurry accordingto this embodiment. The additive solution used may be a solution havingthe additive dissolved in water. The polishing liquid set is used as apolishing liquid by mixing the slurry and additive solution at the timeof polishing. By thus separately storing the constituent components ofthe polishing liquid into at least two liquids, it is possible to obtaina polishing liquid with excellent storage stability.

The additives used in the additive solution may be the same additives asdescribed for the polishing liquid. The content of additives in theadditive solution is preferably 0.01-20 mass % and more preferably0.02-20 mass %, based on the total mass of the additive solution, fromthe viewpoint of inhibiting excessive reduction in the polishing ratewhen the additive solution and slurry are mixed to form the polishingliquid.

There are no particular restrictions on the water for the additivesolution, but deionized water or ultrapure water is preferred. The watercontent is not particularly restricted and may be the content of theremainder excluding the other constituent components.

<Substrate Polishing Method and Substrate>

According to this embodiment, it is also possible to provide a polishingmethod using the aforementioned slurry, polishing liquid set orpolishing liquid, and a substrate obtained by the method. A substratepolishing method using the aforementioned slurry, polishing liquid setor polishing liquid, and a substrate obtained by the method, will now bedescribed. When the polishing liquid or slurry is to be used, it will bea polishing method using a one-pack type polishing liquid, and when thepolishing liquid set is to be used, it will be a polishing method usinga two-pack type polishing liquid or a three-pack or greater typepolishing liquid. The substrate polishing method of this embodiment hasexcellent throughput since it allows polishing of films at superiorpolishing rate, while permitting desired properties (such as flatnessand selectivity) to be obtained when using additives.

A substrate of this embodiment can be obtained by polishing with thesubstrate polishing method according to this embodiment. In thesubstrate polishing method of this embodiment, polishing is performed ona substrate having a film to be polished on its surface. In thesubstrate polishing method of this embodiment, the film to be polishedmay be polished using a stopper film formed under the film to bepolished. The substrate polishing method of this embodiment comprises atleast a substrate positioning step and a polishing step. In thesubstrate positioning step, a film to be polished, of a substrate whichhas the film to be polished on its surface, is placed so as to face anabrasive pad.

The film to be polished is preferably an inorganic insulating film, suchas a silicon oxide film. The silicon oxide film can be obtained by alow-pressure CVD method, plasma CVD, or the like. The silicon oxide filmmay be doped with an element such as phosphorus or boron. The inorganicinsulating film may be a Low-k film or the like. The surface of the filmto be polished (surface to be polished) preferably has irregularities.In the substrate polishing method of this embodiment, the convexities ofthe irregularities of the film to be polished are preferentiallypolished, to obtain a substrate with a flattened surface.

When a slurry is to be used as a one-pack type polishing liquid, thesubstrate polishing method of this embodiment comprises, for example, asubstrate positioning step, and a polishing step in which at least aportion of a film to be polished is polished while supplying a slurryobtained by the aforementioned production method for a slurry betweenthe abrasive pad and the film to be polished.

When a polishing liquid is to be used as a one-pack type polishingliquid, the substrate polishing method of this embodiment comprises, forexample, a substrate positioning step, and a polishing step in which atleast a portion of a film to be polished is polished while supplying apolishing liquid between the abrasive pad and the film to be polished.In this case, a polishing liquid preparation step may be carried outbefore the polishing step. The polishing liquid preparation step may be,for example, the following steps (A) to (C).

(A) A step of mixing a slurry obtained by the aforementioned productionmethod for a slurry, and an additive to obtain a polishing liquid.

(B) A step of mixing abrasive grains obtained by the aforementionedproduction method for abrasive grains, and an additive and water toobtain a polishing liquid.

(C) A step of mixing the slurry (first liquid) of the aforementionedpolishing liquid set and the additive solution (second liquid) to obtaina polishing liquid. In this case, the slurry and additive solution areconveyed through separate liquid conveyance systems (for example,tubings), and the tubings are merged just before the supply tubingoutlet to obtain a polishing liquid.

In the polishing step, in the state that the film to be polished of thesubstrate is pressed against the abrasive pad of the polishing platen,at least a portion of the film to be polished may be polished byrelatively moving the substrate and the polishing platen while supplyingthe slurry or polishing liquid between the abrasive pad and the film tobe polished. Here, the slurry or polishing liquid may be supplied ontothe abrasive pad directly as a slurry or polishing liquid with theprescribed water content.

When a two-pack type of polishing liquid is to be used, the substratepolishing method of this embodiment comprises, for example, a substratepositioning step, and a polishing step in which at least a portion ofthe film to be polished is polished while respectively supplying theslurry (first liquid) of the aforementioned polishing liquid set and theadditive solution (second liquid) between the abrasive pad and the filmto be polished. In this case, in the polishing step, at least a portionof the film to be polished is polished by a polishing liquid obtained bymixing a slurry and an additive solution. In this polishing method, theslurry and additive solution can be supplied onto the abrasive padthrough separate liquid conveyance systems (for example, tubings).

From the viewpoint of minimizing costs for preservation, transport andstorage, the polishing liquid and slurry of this embodiment can bestored as a storage solution for a polishing liquid or a storagesolution for a slurry to be used, for example, in a two-fold or greaterdilution with a liquid medium such as water at the time of use. Thestorage solution may be diluted with the liquid medium immediatelybefore polishing, or the storage solution and liquid medium may besupplied onto the abrasive pad for dilution on the abrasive pad.

Since a greater dilution factor of the storage solution results in agreater effect of minimizing cost for preservation, transport andstorage, it is preferably two-fold or greater and more preferably 3-foldor greater. There are no particular restrictions on the upper limit, buta greater dilution factor requires a greater amount of components in thestorage solution (a higher concentration), which tend to lower thestability during storage, and therefore it is preferably not greaterthan 500-fold, more preferably not greater than 200-fold, even morepreferably not greater than 100-fold and especially preferably notgreater than 50-fold. The same is applied for a polishing liquid withthe constituent components divided into 3 or more liquids.

The polishing apparatus to be used in the polishing method of thisembodiment may be, for example, a common polishing apparatus comprisinga holder to hold the substrate with the film to be polished, and apolishing platen that mounts a motor having a variable rotational speedand allows attachment of an abrasive pad. Examples of such polishingapparatuses include a polishing apparatus by Ebara Corp. (ModelEPO-111), and polishing apparatuses by Applied Materials (trade names:Mirra3400 and Reflection Polishing Machine).

There are no particular restrictions on the abrasive pad, and a commonnonwoven fabric, foamed polyurethane, porous fluorine resin or the likemay be used. The abrasive pad is preferably furrowed to allowaccumulation of the polishing liquid.

The polishing conditions are not particularly restricted, but from theviewpoint of minimizing fly off of the semiconductor substrate, therotational speed of the polishing platen is preferably a low speed ofnot greater than 200 rpm. The pressure (machining load) on thesemiconductor substrate is preferably not greater than 100 kPa, from theviewpoint of further minimizing formation of scratches after polishing.The slurry or polishing liquid is preferably continuously supplied tothe surface of the abrasive pad with a pump or the like duringpolishing. The amount supplied is not particularly restricted, but thesurface of the abrasive pad is preferably covered by the slurry orpolishing liquid at all times. Preferably, the polished semiconductorsubstrate is thoroughly rinsed in running water, and is then dried afterremoving off the water droplets adhering to the semiconductor substrateusing a spin dryer or the like.

According to this embodiment, there is provided the use of theaforementioned polishing liquid, slurry and polishing liquid set forpolishing of a film to be polished (for example, a silicon oxide film).Also according to this embodiment, there is provided the use of theaforementioned polishing liquid, slurry and polishing liquid set forpolishing of a film to be polished (for example, a silicon oxide film)using a stopper film (for example, a silicon nitride film).

EXAMPLES

The present invention will now be described in greater detail byexamples, with the understanding that the invention is not limited tothese examples.

Examples 1-14, Comparative Examples 1-3 Preparation of Abrasive GrainsIncluding Tetravalent Metal Element Hydroxide

Abrasive grains including tetravalent metal element hydroxides wereprepared by the following procedure. The values indicated as A to I andZ throughout the explanation below are the values shown in Table 1.

After placing A [L] of water into a container, B [L] of cerium ammoniumnitrate aqueous solution (general formula: Ce(NH₄)₂(NO₃)₆, formulaweight: 548.2 g/mol) at a concentration of 50 mass % was added and mixedtherewith, and the liquid temperature was adjusted to C [° C.] to obtaina metal salt aqueous solution. The metal salt concentration of the metalsalt aqueous solution was as shown in Table 1.

Next, the alkali shown in Table 1 was dissolved in water to prepare E[L] of an aqueous solution at a concentration of D [mol/L], and theliquid temperature was adjusted to a temperature of C [° C.] to obtainan alkali solution.

A cooling device was used to adjust the metal salt aqueous solution tothe temperature indicated by C [° C.] in Table 1. The container holdingthe metal salt aqueous solution was placed in a water tank filled withwater and cooled while adjusting the water temperature of the water tankusing an external-circulating Coolnics Circulator (product name: CoolingThermopump CTP101 by Eyela). The temperature of the metal salt aqueoussolution was kept at C [° C.] while pouring the alkali solution at themixing rate indicated by F [m³/min] in Table 1, and mixing was carriedout at the linear speed indicated by G [m/min], the cycle countindicated by H [min⁻¹] and the substitution count indicated by I [min⁻¹]in Table 1, to obtain slurry precursor 1 containing abrasive grains of atetravalent cerium hydroxide. The area of the stirring blade, the radiusof rotation of the stirring blade and the rotational speed of thestirring blade were as shown in Table 1. The pH of the slurry precursor1 is shown in the column “Final pH” in Table 1, and the ΔpH value, asthe variation in pH per unit time, was as shown in Table 1. The valueused for ΔpH was the average value of the change in pH per minute fromthe start of mixing of the metal salt aqueous solution and alkalisolution until the pH of the liquid mixture reached the “final pH”.Parameter Z was also as shown in Table 1.

TABLE 1 Metal salt aqueous solution Alkali solution Productionparameters 50 mass % metal Alkali Mixing Rotation Stirring Water saltsolution solution speed rate blade area amount amount ConcentrationConcentration amount v R S A [L] B [L] [mol/L] Alkali type D [mol/L] E[L] F [m³/min] [min⁻¹] [m²] Example 1 1.840 0.053 0.037 Ammonia 8.80.029 0.000005 500 0.0005 Example 2 1.656 0.048 0.037 Imidazole 1.50.148 0.00001 500 0.0005 Example 3 1.656 0.048 0.037 Imidazole 1.5 0.1570.00001 500 0.0005 Example 4 1.656 0.048 0.037 Imidazole 1.5 0.1520.00001 200 0.0020 Example 5 1.656 0.048 0.037 Imidazole 1.5 0.1520.00001 500 0.0005 Example 6 1.656 0.048 0.037 Imidazole 1.5 0.1520.00001 500 0.0005 Example 7 1.656 0.048 0.037 Imidazole 1.5 0.1520.000007 500 0.0005 Example 8 1.656 0.048 0.037 Imidazole 1.5 0.1520.000015 500 0.0005 Example 9 165.600 4.767 0.037 Imidazole 1.5 15.20.00008 100 0.0340 Example 10 165.600 4.767 0.037 Imidazole 1.5 15.20.00008 70 0.0340 Example 11 1.656 0.048 0.037 Imidazole 2.9 0.0760.000005 200 0.0020 Example 12 1.587 0.095 0.075 Imidazole 1.5 0.3040.00001 200 0.0020 Example 13 1.587 0.095 0.075 Imidazole 1.5 0.3040.000007 300 0.0020 Example 14 1.691 0.024 0.018 Imidazole 1.5 0.0780.000007 500 0.0005 Comp. Ex. 1 1.840 0.053 0.037 Ammonia 14.7 0.0170.000025 150 0.0005 Comp. Ex. 2 2.500 0.028 0.014 Potassium 1.8 0.0700.00001 400 0.0005 hydroxide Comp. Ex. 3 1.840 0.053 0.037 Ammonia 14.70.017 0.00001 500 0.0005 Production parameters Rotation Synthesis LinearCycle Substitution radius temp. speed count count r T Final ΔpH u N MParameter [m] C [° C.] pH [min⁻¹] G [m/min] H [min⁻¹] I [min⁻¹] ZExample 1 0.025 20 5.2 0.69 78.50 19.63 0.0026 7.73 Example 2 0.025 253.5 0.16 78.50 20.37 0.0054 17.14 Example 3 0.025 25 5.2 0.25 78.5020.26 0.0054 10.46 Example 4 0.040 25 4.2 0.20 50.24 54.31 0.0054 36.00Example 5 0.025 10 5.2 0.26 78.50 20.37 0.0054 28.64 Example 6 0.025 155.2 0.26 78.50 20.37 0.0054 20.25 Example 7 0.025 10 5.2 0.18 78.5020.37 0.0038 58.44 Example 8 0.025 5 5.2 0.39 78.50 20.37 0.0081 18.00Example 9 0.150 15 5.2 0.02 94.20 17.26 0.0004 2689.36 Example 10 0.15020 5.2 0.02 65.94 12.08 0.0004 1331.16 Example 11 0.040 20 5.2 0.2650.24 56.45 0.0028 76.36 Example 12 0.040 15 5.2 0.13 50.24 50.75 0.0051108.00 Example 13 0.040 15 5.2 0.09 75.36 76.12 0.0035 330.60 Example 140.025 20 5.3 0.36 78.50 21.93 0.0039 15.62 Comp. Ex. 1 0.025 25 5.2 5.8823.55 5.92 0.0131 0.05 Comp. Ex. 2 0.025 25 5.2 0.57 62.80 11.64 0.00393.73 Comp. Ex. 3 0.025 25 5.2 2.35 78.50 19.73 0.0052 1.13

Slurry precursor 1 was centrifuged and subjected to solid-liquidseparation by decantation to remove the liquid. The procedure of addinga suitable amount of water to the obtained resultant solid, thoroughlystirring and conducting solid-liquid separation by decantation wascarried out an additional 3 times.

After again adding water to the obtained resultant solid to adjust theliquid volume to 2.0 L, ultrasonic dispersion treatment was carried outfor 180 minutes to obtain slurry precursor 2. A suitable amount of theobtained slurry precursor 2 was sampled, and the mass after drying (thenonvolatile component mass) was measured to calculate the content oftetravalent cerium hydroxide abrasive grains in the slurry precursor 2.

(Measurement of Absorbance and Light Transmittance)

A suitable amount of slurry precursor 2 was sampled and diluted withwater to an abrasive grain content of 0.0065 mass % (65 ppm) to obtain ameasuring sample (aqueous dispersion). Approximately 4 mL of themeasuring sample was placed in a 1 cm-square cell, the cell was set in aspectrophotometer (apparatus name: U3310) by Hitachi, Ltd., andspectrophotometry was performed in a wavelength range of 200-600 nm todetermine the absorbance at a wavelength of 290 nm and the absorbance ata wavelength of 450-600 nm. The results are shown in Table 2.

A suitable amount of slurry precursor 2 was also sampled and dilutedwith water to an abrasive grain content of 1.0 mass % to obtain ameasuring sample (aqueous dispersion). Approximately 4 mL of themeasuring sample was placed in a 1 cm-square cell, the cell was set in aspectrophotometer (apparatus name: U3310) by Hitachi, Ltd., andspectrophotometry was performed in a wavelength range of 200-600 nm tomeasure the absorbance for light with a wavelength of 400 nm and thelight transmittance for light with a wavelength of 500 nm. The resultsare shown in Table 2.

(Measurement of Mean Secondary Particle Size)

A suitable amount of slurry precursor 2 was sampled and diluted withwater to an abrasive grain content of 0.2 mass % to obtain a measuringsample. Approximately 4 mL of the measuring sample was placed in a 1cm-square cell, and the cell was set in an N5, an apparatus name byBeckman Coulter, Inc. Measurement was conducted at 25° C. with adispersing medium refractive index of 1.33 and a viscosity of 0.887mPa·s, and the displayed mean particle size value was read as the meansecondary particle size. The results are shown in Table 2.

TABLE 2 Light transmittance Absorbance Absorbance Absorbance [500 nm][290 nm] [450~600 nm] [400 nm] [%/cm] Mean secondary Abrasive graincontent: Abrasive grain content: particle size 65 ppm 1.0 mass % [nm]Example 1 1.112 <0.010 1.57 62 52 Example 2 1.192 <0.010 2.25 92 21Example 3 1.086 <0.010 1.57 91 26 Example 4 1.230 <0.010 2.04 >99 22Example 5 1.140 <0.010 1.83 >99 25 Example 6 1.153 <0.010 1.88 >99 22Example 7 1.238 <0.010 2.28 >99 24 Example 8 1.133 <0.010 1.98 >99 21Example 9 1.368 <0.010 3.11 >99 19 Example 10 1.271 <0.010 2.84 >99 20Example 11 1.159 <0.010 2.31 >99 24 Example 12 1.191 <0.010 2.60 >99 23Example 13 1.339 <0.010 3.02 >99 18 Example 14 1.201 <0.010 2.02 >99 20Comp. Ex. 1 1.256 <0.010 2.70 41 95 Comp. Ex. 2 1.239 <0.010 2.22 46 91Comp. Ex. 3 1.246 <0.010 2.69 43 101

(Preparation of Polishing Liquids)

Water was added to slurry precursor 2 for adjustment to an abrasivegrain content of 1 mass % to obtain a storage solution for a slurry. Theresults of observing the outer appearance of each storage solution for aslurry are shown in Table 3.

Purified water was added to 60 g of the storage solution for a slurry toobtain a slurry. Also, a 5 mass % polyvinyl alcohol aqueous solution wasprepared as an additive solution. After adding 60 g of the additivesolution to the slurry, the mixture was mixed and stirred to obtain apolishing liquid with an abrasive grain content of 0.2 mass %. Theamount of purified water added was calculated to be for a final abrasivegrain content of 0.2 mass %. The saponification degree of polyvinylalcohol in the polyvinyl alcohol aqueous solution was 80 mol %, and themean polymerization degree was 300. The polyvinyl alcohol content in thepolishing liquid was 1.0 mass %. The pH (25° C.) values of the slurryand polishing liquid, as measured using a Model PH81 by YokogawaElectric Corp., were 3.6 and 6.0.

(Polishing of Insulating Film)

A φ200 mm silicon wafer, with a silicon oxide insulating film formedthereon, was set in the holder of a polishing apparatus, mounting anadsorption pad for substrate attachment. The holder was placed on aporous urethane resin pad-attached platen, with the insulating filmfacing the pad. The substrate was pressed onto the pad at a polishingload of 20 kPa while supplying the obtained polishing liquid onto thepad at a feed rate of 200 cc/min. Polishing was performed for 1 minuteof rotation of the platen at 78 rpm and the holder at 98 rpm. Thepolished wafer was thoroughly washed with purified water and dried. Alight-interference film thickness meter was used to measure the changein film thickness before and after polishing, and the polishing rate wascalculated. The results are shown in Table 3.

TABLE 3 Outer appearance of Polishing rate storage solution for slurry(nm/min) Example 1 Slightly turbid, faint yellow 280 Example 2Transparent, faint yellow 380 Example 3 Transparent, faint yellow 327Example 4 Transparent, faint yellow 350 Example 5 Transparent, faintyellow 365 Example 6 Transparent, faint yellow 355 Example 7Transparent, faint yellow 377 Example 8 Transparent, faint yellow 368Example 9 Transparent, faint yellow 405 Example 10 Transparent, faintyellow 401 Example 11 Transparent, faint yellow 390 Example 12Transparent, faint yellow 410 Example 13 Transparent, faint yellow 418Example 14 Transparent, faint yellow 335 Comp. Ex. 1 Turbid, white 170Comp. Ex. 2 Turbid, white 190 Comp. Ex. 3 Turbid, white 175

Evaluation of the absorbance, light transmittance and polishing ratewere all conducted within 24 hours after preparing slurry precursor 2.

The relationship between absorbance for light with a wavelength of 290nm and polishing rate is shown in FIG. 3, and the relationship betweenabsorbance for light with a wavelength of 400 nm and polishing rate isshown in FIG. 4.

FIG. 5 shows the relationship between parameter Z, set during synthesisof the abrasive grains of the invention, and the polishing rate, FIG. 6shows the relationship between parameter Z and the absorbance for lightwith a wavelength of 290 nm, and FIG. 7 shows the relationship betweenparameter Z and the absorbance for light with a wavelength of 400 nm.

In FIGS. 3 to 7, a case with a light transmittance of 90%/cm or greateris indicated by a circle, a case with a light transmittance of at least50%/cm and less than 90%/cm is indicated by a triangle, and a case witha light transmittance of less than 50%/cm is indicated by a diamond. InFIGS. 5 to 7, the abscissa is a logarithmic axis.

As clearly seen in FIG. 5, a larger value for parameter Z is associatedwith improved polishing rate. Also, as clearly seen in FIGS. 6 and 7,when the light transmittance is 50%/cm or greater, a larger value forparameter Z results in higher absorbance for light of 290 nm or 400 nm.

Next, using a polishing liquid obtained using the slurry of Example 4and a polishing liquid obtained using the slurry of Comparative Example1, the relationship between polyvinyl alcohol (PVA) content of thepolishing liquid and polishing rate was examined. Specifically, thepolishing rates for silicon oxide films were examined in the same manneras Example 1, with polyvinyl alcohol contents of 3.0 mass %, 2.0 mass %,1.0 mass %, 0.5 mass % and 0.1 mass % in the polishing liquid. Theresults are shown in Table 4.

TABLE 4 PVA content (mass %) 3.0 2.0 1.0 0.5 0.1 Polishing rate Comp.Ex. 1 90 135 170 225 232 (nm/min) Example 4 253 312 350 375 384

As is clear by the results in Table 4, the polishing rate in Example 4,which had a light transmittance of at least 50%/cm for light with awavelength of 500 nm, was higher than in Comparative Example 1 withaddition of additives in the same amount, and therefore a wide marginexists for further addition of additives, in addition to polyvinylalcohol. This suggests that the effective number of abrasive grains onthe surface to be polished was maintained by increased lighttransmittance for inhibited formation of coarse aggregated particles,and that increased absorbance allowed the polishing rate to bemaintained at a higher value than Comparative Example 1. This indicatesthat in Example 4 it is possible to impart further properties by addingmore additives, compared to Comparative Example 1.

1-15. (canceled)
 16. A production method for abrasive grains, wherein afirst liquid which is an aqueous solution of a salt of a tetravalentmetal element is mixed with a second liquid which is an alkali solution,under conditions such that parameter Z in the following formula (1a) is5.00 or greater, to yield abrasive grains including a hydroxide of thetetravalent metal element.Z=[1/(ΔpH×k)]×(N/M)/1000  (1a) [In formula (1a), ΔpH represents avariation in pH per minute in a reaction system, k represents a reactiontemperature coefficient represented by the following formula (2), Nrepresents a cycle count (min⁻¹), and M represents a substitution count(min⁻¹) represented by the following formula (5).]k=2^([(T-20)/10])  (2) [In formula (2), T represents a temperature (°C.) of the reaction system.]M=v/Q  (5) [In formula (5), v represents a mixing rate (m³/min) of thefirst liquid and the second liquid, and Q represents a liquid volume(m³) of the liquid mixture.]
 17. The production method according toclaim 16, wherein the ΔpH is not greater than 5.00.
 18. The productionmethod according to claim 16, wherein the cycle count N is 1.00 min⁻¹ orgreater.
 19. The production method according to claim 16, wherein thesubstitution count M is not greater than 1.0 min⁻¹.
 20. The productionmethod according to claim 16, wherein a base of the alkali solution is anitrogen-containing heterocyclic organic base.
 21. The production methodaccording to claim 16, wherein the mixing rate v is not greater than1.00×10⁻² m³/min.
 22. The production method according to claim 16,wherein the temperature T is not higher than 60° C.
 23. The productionmethod according to claim 16, wherein a concentration of the salt of atetravalent metal element is the first liquid is 0.01 mol/L or greater.24. The production method according to claim 16, wherein an alkalineconcentration of the second liquid is not greater than 15.0 mol/L. 25.The production method according to claim 16, wherein a pH of the liquidmixture is 2.0 to 7.0.
 26. The production method according to claim 16,wherein the tetravalent metal element is tetravalent cerium.
 27. Aproduction method for a slurry, wherein abrasive grains obtained by theproduction method according to claim 16 are mixed with water to obtain aslurry.
 28. A production method for a polishing liquid, wherein a slurryobtained by the production method according to claim 27 is mixed with anadditive to obtain a polishing liquid.
 29. A production method for apolishing liquid, wherein abrasive grains obtained by the productionmethod according to claim 16, an additive and water are mixed to obtaina polishing liquid.
 30. A production method for a slurry, whereinabrasive grains obtained by the production method according to claim 26are mixed with water to obtain a slurry.
 31. A production method forpolishing liquid, wherein a slurry obtained by the production methodaccording to claim 30 is mixed with an additive to obtain a polishingliquid.
 32. A production method for a polishing liquid, wherein abrasivegrains obtained by the production method according to claim 26, anadditive and water are mixed to obtain a polishing liquid.